- In a pioneering initiative, the state government collaborates with the Tata Group to establish Assam’s inaugural semiconductor packaging plant.
India has received around 30 billion USD worth of investment proposals in the semiconductor sector, ranging from packaging, design and research and development, the Centre said on Thursday.
Addressing the ‘India Semiconductor and Packaging Ecosystem Conference’ (ISPEC) at SCL Mohali in virtual mode, Union Minister of State for Electronics and IT, Rajeev Chandrasekhar, said that the country is becoming a significant player in the future of semiconductors.
The government of India has received over Rs 2.5 lakh crore worth of investment proposals in a spectrum of opportunities, the minister informed the gathering.
“We have moved from being almost absent in the semiconductor ecosystem and merely a provider of talent to the global semiconductor majors, to now becoming a destination receiving investments and building significant capacity and capability across the spectrum, from manufacturing to design to systems,” he added.
Semiconductor Innovation Focus: Advancing Assam’s Future with a Pioneering Packaging Plant and Commitment to Global Ecosystem Growth
“We have a very deep focus on the research and innovation components of the semiconductor industry. This conference highlights our keen interest in creating a vibrant, robust, and competitive ecosystem centred around innovation, packaging innovation, semiconductor research, chip design, and system design innovation,” said the minister.
Earlier this month, he announced that the state government and the Tata Group are jointly building Assam’s inaugural semiconductor packaging plant, valued at nearly Rs 25,000 crore. According to the minister, “What is yet to come is yet to unfold in the third term of Prime Minister Narendra Modi.”
“The presence of India in the overall semiconductor ecosystem, global ecosystem and the value chain will be significantly bigger, higher, meaningful, and impactful than where it was just two years ago,” he said.
(The article is published under a mutual content partnership arrangement between Finance World and The Free Press Journal)